Semiconductor Packaging & Design
Providing OSAT (Outsourced Semiconductor Assembly & Test) solutions to global Semiconductor companies. OSAT BU provides Complete Turnkey Solutions for the industry's advancing packaging needs. Value added services provided include Package Design & Complete Test Engineering Solutions. Certifications include the ISO 9001:2008, ISO 14001:2004, TS 16949:2009 & Sony Green Partner. Customers spread across USA, Europe & Asia Pacific. To further growth, exploring acquiring OSAT facilities in the Asia Pacific & Prototype/High-end USA facilities, that increase Customer value-addition, complement existing package offerings, expand capacity and grow Customer base.
Design foray is focussed on Design & Verification, HDL & Synthesis, P&R and Tape out Services, provided offshore & onsite via Singapore & India facilities. Plans are to develop IP Building Blocks that will assist Customers with faster time to market.